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DR Series DR4300e - Owner's Manual

DR4300e system overview Technical specifications Initial system setup and configuration Pre-operating system management applications
Options to manage the pre-operating system applications System Setup Dell Lifecycle Controller Boot Manager PXE boot
Installing and removing system components
Safety instructions Before working inside your system After working inside your system Recommended tools Front bezel (optional) System cover Cooling shroud Cooling fans Cooling-fan assembly System memory Processors and heat sinks PCIe card holder Cable retention bracket Integrated storage controller card Expansion cards and expansion card riser Internal dual SD module (optional) Network daughter card Internal USB memory key (optional) System battery Power supply units (PSU) System board Trusted Platform Module Hard drives Hard drive backplane SD vFlash card (optional) Control panel assembly
Using system diagnostics Jumpers and connectors Troubleshooting your system

Memory sparing

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NOTE: To use memory sparing, this feature must be enabled in System Setup.

In this mode, one rank per channel is reserved as a spare. If persistent correctable errors are detected on a rank, the data from this rank is copied to the spare rank, and the failed rank is disabled.

With memory sparing enabled, the system memory available to the operating system is reduced by one rank per channel. For example, in a dual-processor configuration with sixteen 4 GB single-rank memory modules, the available system memory is: 3/4 (ranks/channel) × 16 (memory modules) × 4 GB = 48 GB, and not 16 (memory modules) × 4 GB = 64 GB.

* 
NOTE: Memory sparing does not offer protection against a multi-bit uncorrectable error.
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NOTE: Both Advanced ECC/Lockstep and Optimizer modes support memory sparing.

Memory mirroring

Memory mirroring offers the strongest memory module reliability mode compared to all other modes, providing improved uncorrectable multi-bit failure protection. In a mirrored configuration, the total available system memory is one half of the total installed physical memory. Half of the installed memory is used to mirror the active memory modules. In the event of an uncorrectable error, the system switches over to the mirrored copy. This ensures SDDC and multi-bit protection.

The installation guidelines for memory modules are as follows:

•
Memory modules must be identical in size, speed, and technology.
•
Memory modules installed in memory module sockets with white release levers must be identical and the same rule applies for sockets with black and green release tabs. This ensures that identical memory modules are installed in matched pairs—for example, A1 with A2, A3 with A4, A5 with A6, and so on.

Table 31. Processor configuration

This table describes the memory population and its configuration

Processor

Configuration

Memory population rules

Memory population information

Single CPU

Memory population order

{1,2}, {3,4}

See Memory mirroring note

Sample memory configurations

The following table shows sample memory configurations for two processor configuration that follows the appropriate memory guidelines.
* 
NOTE: 1R and 2R in the following table indicates single and dual ranks DIMMs respectively.

Table 32. Sample Memory configurations

This section describes the memory configurations for a two processors.

System capacity (in GB)

DIMM size (in GB)

Number of DIMMs

DIMM rank, organization, and frequency

DIMM slot population

32

4

8

1R, x8, 2400 MT/s

1R, x8, 2133 MT/s

A1, A2, A3, A4, B1, B2, B3, B4

Removing memory modules

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CAUTION: Many repairs may only be done by a certified service technician. You should only perform troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or telephone service and support team. Damage due to servicing that is not authorized by Dell is not covered by your warranty. Read and follow the safety instructions that are shipped with your product.
1.
Follow the safety guidelines listed in the Safety instructions section.
2.
Follow the procedure listed in the Before working inside your system section.
3.
Remove the cooling shroud.
4.
If installed, remove the cooling fan assembly. For more information, see the Removing the cooling fan assembly section.
* 
NOTE: The memory modules are hot to touch for some time after the system has been powered down. Allow the memory modules to cool before handling them. Handle the memory modules by the card edges and avoid touching the components or metallic contacts on the memory module.
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CAUTION: To ensure proper system cooling, memory module blanks must be installed in any memory socket that is not occupied. Remove memory module blanks only if you intend to install memory modules in those sockets.
1.
Locate the appropriate memory module socket.
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CAUTION: Handle each memory module only by the card edges, ensuring not to touch the middle of the memory module or metallic contacts.
2.
To release the memory module from the socket, simultaneously press the ejectors on both ends of the memory module socket.
3.
Lift and remove the memory module from the system.
Figure 17. Removing the memory module

This figure shows removing the memory module.

a.
memory module
b.
memory module socket
c.
memory module socket ejector (2)
1.
Install the memory module.
* 
NOTE: If you are removing the memory module permanently, install a memory module blank.
2.
Install the cooling shroud.
3.
Follow the procedure listed in the After working inside your system section.
Related tasks 
Before working inside your system
Removing the cooling shroud
Removing the cooling fan assembly
After working inside your system
Related references 
Safety instructions
Related Documents

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