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DR Series DR4300 - Owner's Manual

DR4300 system overview Technical specifications Initial system setup and configuration Pre-operating system management applications
Options to manage the pre-operating system applications System Setup Dell Lifecycle Controller Boot Manager PXE boot
Installing and removing system components
Safety instructions Before working inside your system After working inside your system Recommended tools Front bezel (optional) System cover Cooling shroud Cooling fans Cooling-fan assembly System memory Processors and heat sinks PCIe card holder Cable retention bracket Integrated storage controller card Expansion cards and expansion card riser Internal dual SD module (optional) Network daughter card Internal USB memory key (optional) System battery Power supply units (PSU) System board Trusted Platform Module Hard drives Hard drive backplane SD vFlash card (optional) Control panel assembly
Using system diagnostics Jumpers and connectors Troubleshooting your system

General memory module installation guidelines

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NOTE: Memory configurations that fail to observe these guidelines can prevent your system from booting, stop responding during memory configuration, or operating with reduced memory.

The system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset architectural configuration. The following are the recommended guidelines for installing memory modules:

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x4 and x8 DRAM based memory modules can be mixed. For more information, see the Mode-specific guidelines section.
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Up to three dual- or single-rank RDIMMs can be populated per channel.
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If memory modules with different speeds are installed, they will operate at the speed of the slowest installed memory module(s) or slower depending on system DIMM configuration.
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Populate memory module sockets only if a processor is installed. For single-processor systems, sockets A1 to A12 are available. For dual-processor systems, sockets A1 to A12 and sockets B1 to B12 are available.
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Populate all the sockets with white release tabs first, followed by the black release tabs, and then the green release tabs.
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When mixing memory modules with different capacities, populate the sockets with memory modules with highest capacity first. For example, if you want to mix 4 GB and 8 GB memory modules, populate 8 GB memory modules in the sockets with white release tabs and 4 GB memory modules in the sockets with black release tabs.
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In a dual-processor configuration, the memory configuration for each processor should be identical. For example, if you populate socket A1 for processor 1, then populate socket B1 for processor 2, and so on.
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Memory modules of different capacities can be mixed provided other memory population rules are followed (for example, 4 GB and 8 GB memory modules can be mixed).
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Mixing of more than two memory module capacities in a system is not supported.
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Populate four memory modules per processor (one DIMM per channel) at a time to maximize performance.

Mode-specific guidelines

Advanced Error Correction Code (lockstep)
Memory optimized (independent channel) mode
Memory sparing
Memory mirroring
Four memory channels are allocated to each processor. The allowable configurations depend on the memory mode selected.

Advanced Error Correction Code (lockstep)

Advanced Error Correction Code (ECC) mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This protects against single DRAM chip failures during normal operation.

The installation guidelines for memory modules are as follows:

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Memory modules must be identical in size, speed, and technology.
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DIMMs installed in memory sockets with white release levers must be identical and the same rule applies for sockets with black release levers. This ensures that identical DIMMs are installed in matched pair —for example, A1 with A2, A3 with A4, A5 with A6, and so on.

Memory optimized (independent channel) mode

This mode supports Single Device Data Correction (SDDC) only for memory modules that use x4 device width. It does not impose any specific slot population requirements.

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